(footprint "XDCR_LIS3DHTR" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 63C5A93A)
  (property "MANUFACTURER" "STMicroelectronics")
  (property "MAXIMUM_PACKAGE_HEIGHT" "1mm")
  (property "PARTREV" "2")
  (property "STANDARD" "Manufacturer Recommendations")
  (property "Sheetfile" "Remote.kicad_sch")
  (property "Sheetname" "")
  (attr smd)
  (fp_text reference "U5" (at 2.95 0 180) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 374a0097-2de3-4564-b932-de03f826f800)
  )
  (fp_text value "LIS3DHTR" (at 2.214931 2.197712) (layer "F.Fab")
    (effects (font (size 0.480549 0.480549) (thickness 0.15)))
    (tstamp 52e1e569-3bfd-4f45-a6db-9e1968d681e6)
  )
  (fp_line (start -1.5 1.5) (end -0.99 1.5) (layer "F.SilkS") (width 0.127) (tstamp 2081c3ad-5787-4332-ba82-277e5241665b))
  (fp_line (start 0.99 1.5) (end 1.5 1.5) (layer "F.SilkS") (width 0.127) (tstamp 2a1b7413-e170-4045-9dac-153a3b21bf7e))
  (fp_line (start -0.99 -1.5) (end -1.5 -1.5) (layer "F.SilkS") (width 0.127) (tstamp 9322c011-81bb-41c7-85f5-40c67b722006))
  (fp_line (start 0.99 -1.5) (end 1.5 -1.5) (layer "F.SilkS") (width 0.127) (tstamp a2669417-e994-4b1d-b2f2-3dce289d6e30))
  (fp_circle (center -2 -1.275) (end -1.9 -1.275) (layer "F.SilkS") (width 0.2) (fill none) (tstamp d50ae10a-f8a6-439b-9dad-9976c141662c))
  (fp_line (start 1.75 -1.75) (end -1.75 -1.75) (layer "F.CrtYd") (width 0.05) (tstamp 1da0581e-0634-4f86-a649-40e28a617db1))
  (fp_line (start 1.75 1.75) (end 1.75 -1.75) (layer "F.CrtYd") (width 0.05) (tstamp 90778098-11d2-4387-8034-6fb9e7499f01))
  (fp_line (start -1.75 -1.75) (end -1.75 1.75) (layer "F.CrtYd") (width 0.05) (tstamp e71ab22f-26b3-470d-9261-9b9561982f75))
  (fp_line (start -1.75 1.75) (end 1.75 1.75) (layer "F.CrtYd") (width 0.05) (tstamp fe2760a0-53e7-4010-891f-881eab63f2a9))
  (fp_line (start 1.5 1.5) (end 1.5 -1.5) (layer "F.Fab") (width 0.127) (tstamp 47630037-5ac1-48a3-bd98-d1a71262f6f6))
  (fp_line (start -1.5 -1.5) (end -1.5 1.5) (layer "F.Fab") (width 0.127) (tstamp 556f507a-48ab-4f3c-8abb-3f0f3d91aa76))
  (fp_line (start 1.5 -1.5) (end -1.5 -1.5) (layer "F.Fab") (width 0.127) (tstamp bd3ff0a5-6d77-4d67-8d0b-b4976c46846c))
  (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer "F.Fab") (width 0.127) (tstamp ebb0933f-e66f-4aba-880c-7fca8b9f79d8))
  (fp_circle (center -2 -1.275) (end -1.9 -1.275) (layer "F.Fab") (width 0.2) (fill none) (tstamp c94c5700-aec0-41d1-a114-505756d804f9))
  (pad "1" smd rect (at -1.3 -1 180) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 7ce2738e-4072-48e7-a518-8a580ecee0f5))
  (pad "2" smd rect (at -1.3 -0.5 180) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 04ea73f6-28d1-4d85-9bb8-4e5a753b3f65))
  (pad "3" smd rect (at -1.3 0 180) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 482ffa32-4456-4c86-b66d-dceb6c27eeac))
  (pad "4" smd rect (at -1.3 0.5 180) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp e8e4d6e7-cc95-4968-94fe-07b9bfef73f0))
  (pad "5" smd rect (at -1.3 1 180) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 3b983567-e799-4945-857c-c5f9170ab567))
  (pad "6" smd rect (at -0.5 1.3 90) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 28f8fe79-c66e-4459-92d7-108b74968d32))
  (pad "7" smd rect (at 0 1.3 90) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 914f59c3-ce05-4f40-bfdc-047facb8783a))
  (pad "8" smd rect (at 0.5 1.3 90) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 5f14e7da-b7d5-407f-95b8-eb7749d2a093))
  (pad "9" smd rect (at 1.3 1) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 519d0b87-5fd1-417c-b3ea-eecd61e657e0))
  (pad "10" smd rect (at 1.3 0.5) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp d6e846ea-ffd3-4433-90f9-6fa4e33544d3))
  (pad "11" smd rect (at 1.3 0) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp a91a8bcf-e4a1-416e-8222-7ea6b67da753))
  (pad "12" smd rect (at 1.3 -0.5) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 6c727f12-b586-47f1-9a08-5eb12ad424b2))
  (pad "13" smd rect (at 1.3 -1) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 90f01d37-428b-4c39-804c-41bccfcd87d4))
  (pad "14" smd rect (at 0.5 -1.3 90) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp 7badf7c8-880d-4196-b7b4-8fc3eb5d54f4))
  (pad "15" smd rect (at 0 -1.3 90) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp d23e0d93-144a-486b-b85f-df6457adfb2f))
  (pad "16" smd rect (at -0.5 -1.3 90) (size 0.8 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.05) (tstamp ff5fb629-bba5-476c-9a80-43cb06181e4d))
  (model "${KICAD_USER_3DMODEL_DIR}/LIS3DHTR.step"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz -90 0 0))
  )
)
